7" TFT-LCD
P: Projected Capacitive/ R: Resistive
Standard: 350
High Brightness: 1000
AMI UEFI
Intel N97 Processor, 4C/4T, 2.0GHz, TDP=12W (Alder Lake-N)
ARCHMI-S-807CP/R: Around 30W
SoC
1 x DDR5 4800MHz SO-DIMM, up to 32GB (Alder Lake-N)
Onboard TPM2.0 SPI I/F TPM IC
2 x RJ-45 Type Intel I226V/IT 2.5GbE LAN (PXE/WOL)
Wake on LAN: Support WOL
1 x Terminal Block Type, DC 9~36V Power Input
1 x DB9 Type RS-232/422/485 (COM1, BIOS selection, RS-232 is default)
2 x USB 3.2 Gen 1 Type-A
2 x USB 2.0 Type-A
1~255 sec (system)
1 x M.2 2280 M-Key socket (SATA 3.0, PCIe x1), Default is SATA Type
1 x M.2 2230 E-Key (USB2.0, PCIe x1) for optional Wi-Fi/BT Module
1 x M.2 2242/3402/3052 B-Key (PCIe x1, USB3.2 Gen1, USB2.0) for optional LTE/5G Module
1 x Nano-SIM slot
50,000
1000:1
7" TFT-LCD
Standard: 350
High Brightness: 1000
262K
800 x 480
160 / 160
USB
Projected Capacitive Touch: 90%
Resistive Touch: 80%
P: Projected Capacitive/ R: Resistive
Aluminum Die-casting Chassis
202 x 149 x 58 mm
IP66 Compliant Front Bezel
Panel Mount, VESA 75 x 75
1.37 kg
CE/FCC Class A
-20~60°C (optional w/ WT RAM/SSD)
10 to 95%@ 40˚C, non-condensing
-30~70˚C
Windows 10 IoT Enterprise 2021 LTSC
Windows 11 (21H2) or later
Linux 22.04 or later
ARCHMI-S-807CP(H):
7" WVGA (high brightness) fanless HMI barebone with Intel Alder Lake-N/Processor N CPU, 1 x DDR5 slot, Projected Capacitive touch, 9~36V DC input with adapter, Aluminum chassis.
ARCHMI-S-807CR(H):
7" WVGA (high brightness) fanless HMI barebone with Intel Alder Lake-N/Processor N CPU, 1 x DDR5 slot, Resistive touch screen, 9~36V DC input with adapter, Aluminum chassis.
8" TFT-LCD
P: Projected Capacitive/ R: Resistive
Standard: 450
High Brightness: 1000
AMI UEFI
Intel N97 Processor, 4C/4T, 2.0GHz, TDP=12W (Alder Lake-N)
ARCHMI-S-808CP/R: Around 35W
SoC
1 x DDR5 4800MHz SO-DIMM, up to 32GB (Alder Lake-N)
Onboard TPM2.0 SPI I/F TPM IC
2 x RJ-45 Type Intel I226V/IT 2.5GbE LAN (PXE/WOL)
Wake on LAN: Support WOL
1 x Terminal Block Type, DC 9~36V Power Input
1 x DB9 Type RS-232/422/485 (COM1, BIOS selection, RS-232 is default)
2 x USB 3.2 Gen 1 Type-A
2 x USB 2.0 Type-A
1~255 sec (system)
1 x M.2 2280 M-Key socket (SATA 3.0, PCIe x1), Default is SATA Type
1 x M.2 2230 E-Key (USB2.0, PCIe x1) for optional Wi-Fi/BT Module
1 x M.2 2242/3402/3052 B-Key (PCIe x1, USB3.2 Gen1, USB2.0) for optional LTE/5G Module
1 x Nano-SIM slot
Standard: 40,000
High Brightness: 50,000
Standard: 500:1
High Brightness: 1000:1
8" TFT-LCD
Standard: 450
High Brightness: 1000
Standard: 262K
High Brightness: 16.2M
800 x 600
Standard: 140 / 130
High Brightness: 140 / 120
USB
Projected Capacitive Touch: Over 90%
Resistive Touch: 80%
P: Projected Capacitive/ R: Resistive
Aluminum Die-casting Chassis
231.1 x 176.1 x 69 mm
IP66 Compliant Front Bezel
Panel Mount, VESA 75 x 75
2.14 kg
CE/FCC Class A
-20~60°C (optional w/ WT RAM/SSD)
10 to 95%@ 40˚C, non-condensing
-30~70˚C
Windows 10 IoT Enterprise 2021 LTSC
Windows 11 (21H2) or later
Linux 22.04 or later
ARCHMI-S-808CP(H):
8" SVGA (high brightness) fanless HMI barebone with Intel Alder Lake-N/Processor N CPU, 1 x DDR5 slot, Projected Capacitive touch, 9~36V DC input with adapter, Aluminum chassis.
ARCHMI-S-808CR(H):
8" SVGA (high brightness) fanless HMI barebone with Intel Alder Lake-N/Processor N CPU, 1 x DDR5 slot, Resistive touch screen, 9~36V DC input with adapter, Aluminum chassis.
10.1" TFT-LCD
P: Projected Capacitive/ R: Resistive
Standard: 350
High Brightness: 1000
AMI UEFI
Intel N97 Processor, 4C/4T, 2.0GHz, TDP=12W (Alder Lake-N)
ARCHMI-S-810CP/R: Around 37W
SoC
1 x DDR5 4800MHz SO-DIMM, up to 32GB (Alder Lake-N)
Onboard TPM2.0 SPI I/F TPM IC
2 x RJ-45 Type Intel I226V/IT 2.5GbE LAN (PXE/WOL)
Wake on LAN: Support WOL
1 x Terminal Block Type, DC 9~36V Power Input
1 x DB9 Type RS-232/422/485 (COM1, BIOS selection, RS-232 is default)
1 x DB9 Type RS-232/422/485 (COM2, BIOS selection, RS-232 is default)
1 x DB9 Type RS-232(COM3)
2 x USB 3.2 Gen1 Type-A
2 x USB 2.0 Type-A
1~255 sec (system)
1 x M.2 2280 M-Key socket (SATA 3.0, PCIe x1), Default is SATA Type
1 x M.2 2230 E-Key (USB2.0, PCIe x1) for optional Wi-Fi/BT Module
1 x M.2 2242/3402/3052 B-Key (PCIe x1, USB3.2 Gen1, USB2.0) for optional LTE/5G Module
1 x Nano-SIM slot
Standard: 30,000
High Brightness: 50,000
Standard: 800:1
High Brightness: 1200:1
10.1" TFT-LCD
Standard: 350
High Brightness: 1000
16.7M
Standard: 1280 x 800
High Brightness: 1280 x 600
Standard: 170 / 170
High Brightness: 178 / 178
USB
Projected Capacitive Touch: Over 90%
Resistive Touch: 80%
P: Projected Capacitive/ R: Resistive
Aluminum Die-casting Chassis
285 x 189 x 75 mm
IP66 Compliant Front Bezel
Panel Mount, VESA 100 x 100
2.57 kg
CE/FCC Class A
-20~60°C (optional w/ WT RAM/SSD)
High Brightness: 0~50°C
10 to 95%@ 40˚C, non-condensing
-30~70˚C
Windows 10 IoT Enterprise 2021 LTSC
Windows 11 (21H2) or later
Linux 22.04 or later
ARCHMI-S-810CP(H):
10.1" WXGA (High brightness) fanless HMI barebone with Intel Alder Lake-N/Processor N CPU, 1 x DDR5 slot, Projected Capacitive touch, 9~36V DC input with adapter, Aluminum chassis.
ARCHMI-S-810CR(H):
10.1" WXGA (High brightness) fanless HMI barebone with Intel Alder Lake-N/Processor N CPU, 1 x DDR5 slot, Resistive touch screen, 9~36V DC input with adapter, Aluminum chassis.
12.1" TFT-LCD
P: Projected Capacitive/ R: Resistive
Standard: 450 (default), 500 (optional)
High Brightness: 1000
AMI UEFI
Intel N97 Processor, 4C/4T, 2.0GHz, TDP=12W (Alder Lake-N)
ARCHMI-S-812CP/R: Around 45W
SoC
1 x DDR5 4800MHz SO-DIMM, up to 32GB (Alder Lake-N)
Onboard TPM2.0 SPI I/F TPM IC
2 x RJ-45 Type Intel I226V/IT 2.5GbE LAN (PXE/WOL)
Wake on: LAN Support WOL
1 x Terminal Block Type, DC 9~36V Power Input
1 x DB9 Type RS-232/422/485 (COM1, BIOS selection, RS-232 is default)
1 x DB9 Type RS-232/422/485 (COM2, BIOS selection, RS-232 is default)
1 x DB9 Type RS-232(COM3)
2 x USB 3.2 Gen1 Type-A
2 x USB 2.0 Type-A
1~255 sec (system)
1 x M.2 2280 M-Key socket (SATA 3.0, PCIe x1), Default is SATA Type
1 x M.2 2230 E-Key (USB2.0, PCIe x1) for optional Wi-Fi/BT Module
1 x M.2 2242/3402/3052 B-Key (PCIe x1, USB3.2 Gen1, USB2.0) for optional LTE/5G Module
1 x Nano-SIM slot
Standard: 50,000 (default), 30,000 (optional)
High Brightness: 50,000 (default), 70,000 (optional)
Standard: 1500:1 (default), 1000:1 (optional)
High Brightness: 1000:1
12.1" TFT-LCD
Standard: 450 (default), 500 (optional)
High Brightness: 1000
Standard: 16.2M
High Brightness: 16.7M (default), 16.2M (optional)
800 x 600 (default)
1024 x 768 (optional)
Standard: 178 / 178
High Brightness: 176 / 176 (default), 178 / 178 (optional)
USB
Projected Capacitive Touch: Over 90%
Resistive Touch: 80%
P: Projected Capacitive/ R: Resistive
Aluminum Die-casting Chassis
319 x 244.9 x 77 mm
IP66 Compliant Front Bezel
Panel Mount, VESA 100 x 100
3.34 kg
CE/FCC Class A
-20~60°C (optional w/ WT RAM/SSD)
High Brightness: 0~50°C
10 to 95%@ 40˚C, non-condensing
-30~70˚C
Windows 10 IoT Enterprise 2021 LTSC
Windows 11 (21H2) or later
Linux 22.04 or later
ARCHMI-S-812CP(H):
12.1" SVGA/XGA (High brightness) fanless HMI barebone with Intel Alder Lake-N/Processor N CPU, 1 x DDR5 slot, Projected Capacitive touch, 9~36V DC input with adapter, Aluminum chassis.
ARCHMI-S-812CR(H):
12.1" SVGA/XGA (High brightness) fanless HMI barebone with Intel Alder Lake-N/Processor N CPU, 1 x DDR5 slot, Resistive touch screen, 9~36V DC input with adapter, Aluminum chassis.
12.1" TFT-LCD Wide
P: Projected Capacitive/ R: Resistive
Standard: 400
High Brightness: 1000
AMI UEFI
Intel N97 Processor, 4C/4T, 2.0GHz, TDP=12W (Alder Lake-N)
ARCHMI-S-812WCP/R: Around 37W
SoC
1 x DDR5 4800MHz SO-DIMM, up to 32GB (Alder Lake-N)
Onboard TPM2.0 SPI I/F TPM IC
2 x RJ-45 Type Intel I226V/IT 2.5GbE LAN (PXE/WOL)
Wake on: LAN Support WOL
1 x Terminal Block Type, DC 9~36V Power Input
1 x DB9 Type RS-232/422/485 (COM1, BIOS selection, RS-232 is default)
1 x DB9 Type RS-232/422/485 (COM2, BIOS selection, RS-232 is default)
1 x DB9 Type RS-232(COM3)
2 x USB 3.2 Gen1 Type-A
2 x USB 2.0 Type-A
1~255 sec (system)
1 x M.2 2280 M-Key socket (SATA 3.0, PCIe x1), Default is SATA Type
1 x M.2 2230 E-Key (USB2.0, PCIe x1) for optional Wi-Fi/BT Module
1 x M.2 2242/3402/3052 B-Key (PCIe x1, USB3.2 Gen1, USB2.0) for optional LTE/5G Module
1 x Nano-SIM slot
50,000
Standard: 1200:1
High Brightness: 1000:1
12.1" TFT-LCD Wide
Standard: 400
High Brightness: 1000
16.7M
Standard: 1280 x 800
High Brightness: 1280 x 600
Standard: 170 / 170
High Brightness: 176 / 176
USB
Projected Capacitive Touch: Over 90%
Resistive Touch: 80%
P: Projected Capacitive/ R: Resistive
Aluminum Die-casting Chassis
328 x 227 x 78 mm
IP66 Compliant Front Bezel
Panel Mount, VESA 100 x 100
3.16 kg
CE/FCC Class A
-20~60°C (optional w/ WT RAM/SSD)
High Brightness: 0~50°C
10 to 95%@ 40˚C, non-condensing
-30~70˚C
Windows 10 IoT Enterprise 2021 LTSC
Windows 11 (21H2) or later
Linux 22.04 or later
ARCHMI-S-812WCP(H):
12.1" WXGA (High brightness) fanless HMI barebone with Intel Alder Lake-N/Processor N CPU, 1 x DDR5 slot, Projected Capacitive touch, 9~36V DC input with adapter, Aluminum chassis.
ARCHMI-S-812WCR(H):
12.1" WXGA (High brightness) fanless HMI barebone with Intel Alder Lake-N/Processor N CPU, 1 x DDR5 slot, Resistive touch screen, 9~36V DC input with adapter, Aluminum chassis.
15" TFT-LCD
P: Projected Capacitive/ R: Resistive
Standard: 350
High Brightness: 1000
AMI UEFI
Intel N97 Processor, 4C/4T, 2.0GHz, TDP=12W (Alder Lake-N)
ARCHMI-S-815CP/R: Around 44W
SoC
1 x DDR5 4800MHz SO-DIMM, up to 32GB (Alder Lake-N)
Onboard TPM2.0 SPI I/F TPM IC
2 x RJ-45 Type Intel I226V/IT 2.5GbE LAN (PXE/WOL)
Wake on LAN: Support WOL
1 x Terminal Block Type, DC 9~36V Power Input
1 x DB9 Type RS-232/422/485 (COM1, BIOS selection, RS-232 is default)
1 x DB9 Type RS-232/422/485 (COM2, BIOS selection, RS-232 is default)
1 x DB9 Type RS-232(COM3)
2 x USB 3.2 Gen1 Type-A
2 x USB 2.0 Type-A
1~255 sec (system)
1 x M.2 2280 M-Key socket (SATA 3.0, PCIe x1), Default is SATA Type
1 x M.2 2230 E-Key (USB2.0, PCIe x1) for optional Wi-Fi/BT Module
1 x M.2 2242/3402/3052 B-Key (PCIe x1, USB3.2 Gen1, USB2.0) for optional LTE/5G Module
1 x Nano-SIM slot
Standard: 50,000
High Brightness: 70,000
Standard: 1000:1
High Brightness: 3000:1
15" TFT-LCD
Standard: 350
High Brightness: 1000
16.7M
1024 x 768
Standard: 178 / 178
High Brightness: 176 / 176
USB
Projected Capacitive Touch: Over 90%
Resistive Touch: 80%
P: Projected Capacitive/ R: Resistive
Aluminum Die-casting Chassis
410.2 x 310.2 x 78.7 mm
IP66 Compliant Front Bezel
Panel Mount, VESA 100 x 100
4.85 kg
CE/FCC Class A
-20~60°C (optional w/ WT RAM/SSD)
High Brightness: 0~50°C
10 to 95%@ 40˚C, non-condensing
-30~70˚C
Windows 10 IoT Enterprise 2021 LTSC
Windows 11 (21H2) or later
Linux 22.04 or later
ARCHMI-S-815CP(H):
15" XGA (High brightness) fanless HMI barebone with Intel Alder Lake-N/Processor N CPU, 1 x DDR5 slot, Projected Capacitive touch, 9~36V DC input with adapter, Aluminum chassis.
ARCHMI-S-815CR(H):
15" XGA (High brightness) fanless HMI barebone with Intel Alder Lake-N/Processor N CPU, 1 x DDR5 slot, Resistive touch screen, 9~36V DC input with adapter, Aluminum chassis.
15.6" TFT-LCD
P: Projected Capacitive/ R: Resistive
Standard: 500
High Brightness: 1000
AMI UEFI
Intel N97 Processor, 4C/4T, 2.0GHz, TDP=12W (Alder Lake-N)
ARCHMI-S-816CP/R: Around 47W
SoC
1 x DDR5 4800MHz SO-DIMM, up to 32GB (Alder Lake-N)
Onboard TPM2.0 SPI I/F TPM IC
2 x RJ-45 Type Intel I226V/IT 2.5GbE LAN (PXE/WOL)
Wake on LAN: Support WOL
1 x Terminal Block Type, DC 9~36V Power Input
1 x DB9 Type RS-232/422/485 (COM1, BIOS selection, RS-232 is default)
1 x DB9 Type RS-232/422/485 (COM2, BIOS selection, RS-232 is default)
1 x DB9 Type RS-232(COM3)
2 x USB 3.2 Gen1 Type-A
2 x USB 2.0 Type-A
1~255 sec (system)
1 x M.2 2280 M-Key socket (SATA 3.0, PCIe x1), Default is SATA Type
1 x M.2 2230 E-Key (USB2.0, PCIe x1) for optional Wi-Fi/BT Module
1 x M.2 2242/3402/3052 B-Key (PCIe x1, USB3.2 Gen1, USB2.0) for optional LTE/5G Module
1 x Nano-SIM slot
50,000
1000:1
15.6" TFT-LCD
Standard: 500
High Brightness: 1000
16.7M
1920 x 1080
Standard: 178 / 178
High Brightness: 170 / 170
USB
Projected Capacitive Touch: Over 90%
Resistive Touch: 80%
P: Projected Capacitive/ R: Resistive
Aluminum Die-casting Chassis
412 x 277.5 x 78 mm
IP66 Compliant Front Bezel
Panel Mount, VESA 100 x 100
4.13 kg
CE/FCC Class A
-20~60°C (optional w/ WT RAM/SSD)
High Brightness: 0~50°C
10 to 95%@ 40˚C, non-condensing
-30~70˚C
Windows 10 IoT Enterprise 2021 LTSC
Windows 11 (21H2) or later
Linux 22.04 or later
ARCHMI-S-816CP(H):
15.6" FHD (High brightness) fanless HMI barebone with Intel Alder Lake-N/Processor N CPU, 1 x DDR5 slot, Projected Capacitive touch, 9~36V DC input with adapter, Aluminum chassis.
ARCHMI-S-816CR(H):
15.6" FHD (High brightness) fanless HMI barebone with Intel Alder Lake-N/Processor N CPU, 1 x DDR5 slot, Resistive touch screen, 9~36V DC input with adapter, Aluminum chassis.
17" TFT-LCD
P: Projected Capacitive/ R: Resistive
Standard: 350
High Brightness: 1000
AMI UEFI
Intel N97 Processor, 4C/4T, 2.0GHz, TDP=12W (Alder Lake-N)
ARCHMI-S-817CP/R: TBD
SoC
1 x DDR5 4800MHz SO-DIMM, up to 32GB (Alder Lake-N)
Onboard TPM2.0 SPI I/F TPM IC
2 x RJ-45 Type Intel I226V/IT 2.5GbE LAN (PXE/WOL)
Wake on LAN: Support WOL
1 x Terminal Block Type, DC 9~36V Power Input
1 x DB9 Type RS-232/422/485 (COM1, BIOS selection, RS-232 is default)
1 x DB9 Type RS-232/422/485 (COM2, BIOS selection,RS-232 is default)
1 x DB9 Type RS-232(COM3)
2 x USB 3.2 Gen1 Type-A
2 x USB 2.0 Type-A
1~255 sec (system)
1 x M.2 2280 M-Key socket (SATA 3.0, PCIe x1), Default is SATA Type
1 x M.2 2230 E-Key (USB2.0, PCIe x1) for optional Wi-Fi/BT Module
1 x M.2 2242/3402/3052 B-Key (PCIe x1, USB3.2 Gen1, USB2.0) for optional LTE/5G Module
1 x Nano-SIM slot
50,000
Standard: 1000:1
High Brightness: 800:1
17" TFT-LCD
Standard: 350
High Brightness: 1000
16.7M
1280 x 1024
Standard: 160 / 140
High Brightness: 170 / 160
USB
Projected Capacitive Touch: Over 90%
Resistive Touch: 80%
P: Projected Capacitive/ R: Resistive
Aluminum Die-casting Chassis
439 x 348 x 82 mm
IP66 Compliant Front Bezel
Panel Mount, VESA 100 x 100
5.97 kg
CE/FCC Class A
-20~60°C (optional w/ WT RAM/SSD)
High Brightness: 0~50°C
10 to 95%@ 40˚C, non-condensing
-30~70˚C
Windows 10 IoT Enterprise 2021 LTSC
Windows 11 (21H2) or later
Linux 22.04 or later
ARCHMI-S-817CP(H):
17" SXGA (High brightness) fanless HMI barebone with Intel Alder Lake-N/Processor N CPU, 1 x DDR5 slot, Projected Capacitive touch, 9~36V DC input with adapter, Aluminum chassis.
ARCHMI-S-817CR(H):
17" SXGA (High brightness) fanless HMI barebone with Intel Alder Lake-N/Processor N CPU, 1 x DDR5 slot, Resistive touch screen, 9~36V DC input with adapter, Aluminum chassis.
18.5" TFT-LCD
P: Projected Capacitive/ R: Resistive
Standard: 350
High Brightness: 1000
AMI UEFI
Intel N97 Processor, 4C/4T, 2.0GHz, TDP=12W (Alder Lake-N)
ARCHMI-S-818CP/R: TBD
SoC
1 x DDR5 4800MHz SO-DIMM, up to 32GB (Alder Lake-N)
Onboard TPM2.0 SPI I/F TPM IC
2 x RJ-45 Type Intel I226V/IT 2.5GbE LAN (PXE/WOL)
Wake on LAN: Support WOL
1 x Terminal Block Type, DC 9~36V Power Input
1 x DB9 Type RS-232/422/485 (COM1, BIOS selection, RS-232 is default)
1 x DB9 Type RS-232/422/485 (COM2, BIOS selection, RS-232 is default)
1 x DB9 Type RS-232(COM3)
2 x USB 3.2 Gen1 Type-A
2 x USB 2.0 Type-A
1~255 sec (system)
1 x M.2 2280 M-Key socket (SATA 3.0, PCIe x1), Default is SATA Type
1 x M.2 2230 E-Key (USB2.0, PCIe x1) for optional Wi-Fi/BT Module
1 x M.2 2242/3402/3052 B-Key (PCIe x1, USB3.2 Gen1, USB2.0) for optional LTE/5G Module
1 x Nano-SIM slot
50,000
1000:1
18.5" TFT-LCD
Standard: 350
High Brightness: 1000
16.7M
1920 x 1080
178 / 178
USB
Projected Capacitive Touch: Over 90%
Resistive Touch: 80%
P: Projected Capacitive/ R: Resistive
Aluminum Die-casting Chassis
499.6 x 314.6 x 82 mm
IP66 Compliant Front Bezel
Panel Mount, VESA 100 x 100
6.85 kg
CE/FCC Class A
-20~60°C (optional w/ WT RAM/SSD)
High Brightness: 0~50°C
10 to 95%@ 40˚C, non-condensing
-30~70˚C
Windows 10 IoT Enterprise 2021 LTSC
Windows 11 (21H2) or later
Linux 22.04 or later
ARCHMI-S-818CP(H):
18.5" FHD (High brightness) fanless HMI barebone with Intel Alder Lake-N/Processor N CPU, 1 x DDR5 slot, Projected Capacitive touch, 9~36VDC input with adapter, Aluminum chassis.
ARCHMI-S-818CR(H):
18.5" FHD (High brightness) fanless HMI barebone with Intel Alder Lake-N/Processor N CPU, 1 x DDR5 slot, Resistive touch screen, 9~36V DC input with adapter, Aluminum chassis.
19" TFT-LCD
P: Projected Capacitive/ R: Resistive
Standard: 350
High Brightness: 1000
AMI UEFI
Intel N97 Processor, 4C/4T, 2.0GHz, TDP=12W (Alder Lake-N)
ARCHMI-S-819CP/R: Around 44W
SoC
1 x DDR5 4800MHz SO-DIMM, up to 32GB (Alder Lake-N)
Onboard TPM2.0 SPI I/F TPM IC
2 x RJ-45 Type Intel I226V/IT 2.5GbE LAN (PXE/WOL)
Wake on LAN: Support WOL
1 x Terminal Block Type, DC 9~36V Power Input
1 x DB9 Type RS-232/422/485 (COM1, BIOS selection, RS-232 is default)
1 x DB9 Type RS-232/422/485 (COM2, BIOS selection, RS-232 is default)
1 x DB9 Type RS-232(COM3)
2 x USB 3.2 Gen1 Type-A
2 x USB 2.0 Type A
1~255 sec (system)
1 x M.2 2280 M-Key socket (SATA 3.0, PCIe x1), Default is SATA Type
1 x M.2 2230 E-Key (USB2.0, PCIe x1) for optional Wi-Fi/BT Module
1 x M.2 2242/3402/3052 B-Key (PCIe x1, USB3.2 Gen1, USB2.0) for optional LTE/5G Module
1 x Nano-SIM slot
50,000
Standard: 1000:1
High Brightness: 1200:1
19" TFT-LCD
Standard: 350
High Brightness: 1000
16.7M
1280 x 1024
170 / 160
USB
Projected Capacitive Touch: Over 90%
Resistive Touch: 80%
P: Projected Capacitive/ R: Resistive
Aluminum Die-casting Chassis
468 x 380 x 82 mm
IP66 Compliant Front Bezel
Panel Mount, VESA 100 x 100
7.22 kg
CE/FCC Class A
-20~60°C (optional w/ WT RAM/SSD)
High Brightness: 0~50°C
10 to 95%@ 40˚C, non-condensing
-30~70˚C
Windows 10 IoT Enterprise 2021 LTSC
Windows 11 (21H2) or later
Linux 22.04 or later
ARCHMI-S-819CP(H):
19" SXGA (High brightness) fanless HMI barebone with Intel Alder Lake-N/Processor N CPU, 1 x DDR5 slot, Projected Capacitive touch, 9~36Vdc input with adapter, Aluminum chassis.
ARCHMI-S-819CR(H):
19" SXGA (High brightness) fanless HMI barebone with Intel Alder Lake-N/Processor N CPU, 1 x DDR5 slot, Resistive touch screen, 9~36Vdc input with adapter, Aluminum chassis
21.5" TFT-LCD
P: Projected Capacitive/ R: Resistive
Standard: 250
High Brightness: 1000
AMI UEFI
Intel N97 Processor, 4C/4T, 2.0GHz, TDP=12W (Alder Lake-N)
ARCHMI-S-821CP/R: Around 44W
SoC
1 x DDR5 4800MHz SO-DIMM, up to 32GB (Alder Lake-N)
Onboard TPM2.0 SPI I/F TPM IC
2 x RJ-45 Type Intel I226V/IT 2.5GbE LAN (PXE/WOL)
Wake on LAN: Support WOL
1 x Terminal Block Type, DC 9~36V Power Input
1 x DB9 Type RS-232/422/485 (COM1, BIOS selection, RS-232 is default)
1 x DB9 Type RS-232/422/485 (COM2, BIOS selection, RS-232 is default)
1 x DB9 Type RS-232(COM3)
2 x USB 3.2 Gen1 Type-A
2 x USB 2.0 Type A
-
1 x M.2 2280 M-Key socket (SATA 3.0, PCIe x1), Default is SATA Type
1 x M.2 2230 E-Key (USB2.0, PCIe x1) for optional Wi-Fi/BT Module
1 x M.2 2242/3402/3052 B-Key (PCIe x1, USB3.2 Gen1, USB2.0) for optional LTE/5G Module
1 x Nano-SIM slot
50,000
1000:1
21.5" TFT-LCD
Standard: 250
High Brightness: 1000
16.7M
1920 x 1080
178 / 178
USB
Projected Capacitive Touch: Over 90%
Resistive Touch: 80%
P: Projected Capacitive/ R: Resistive
Aluminum Die-casting Chassis
557.3 x 362.3 x 81.4 mm
IP66 Compliant Front Bezel
Panel Mount, VESA 100 x 100
6.84 kg
CE/FCC Class A
0~50˚C
10 to 95%@ 40˚C, non-condensing
-30~70˚C
Windows 10 IoT Enterprise 2021 LTSC
Windows 11 (21H2) or later
Linux 22.04 or later
ARCHMI-S-821CP(H):
21.5" FHD (High brightness) fanless HMI barebone with Intel Alder Lake-N/Processor N CPU, 1 x DDR5 slot, Projected Capacitive touch, 9~36V DC input with adapter, Aluminum chassis.
ARCHMI-S-821CR(H):
21.5" FHD (High brightness) fanless HMI barebone with Intel Alder Lake-N/Processor N CPU, 1 x DDR5 slot, Resistive touch screen, 9~36V DC input with adapter, Aluminum chassis.
