7" TFT-LCD
P: Projected Capacitive/ R: Resistive
Standard: 350
High Brightness: 1000
AMI UEFI
Intel Celeron J6412 Quad Core Processor
ARCHMI-S-807BP/R: 27W (Max)
SoC
1 x DDR4 3200MHz SO-DIMM, up to 32GB
Onboard TPM2.0 SPI I/F TPM IC
1 x Line-out
1 x DisplayPort 1.4: Up to 4096 x 2160@60Hz
1 x RJ45 Type Intel I210AT 1GbE LAN
1 x RJ45 Type Intel I225LM/I226LM 2.5GbE LAN
*Wake on LAN: Support WOL
1 x Terminal Block Type, 9-36V DC Power input
1 x DB9 RS-232/422/485 (COM1, BIOS selection)
2 x USB 3.2 Type A
1~255 sec (system)
1 x M.2 M-Key 2242/2280 for SSD (SATA3)
1 x Mini-PCIe slot (full size, PCIe3.0 x1, USB2.0), with 1 x micro SIM slot
1 x M.2 E-Key 2230 for WiFi/BT module (USB2.0, PCIe3.0 x1)
40,000
1000:1
7" TFT-LCD
Standard: 350
High Brightness: 1000
262K
800 x 480
160 / 160
USB
Projected Capacitive Touch: Over 90%
Resistive Touch: 80%
P: Projected Capacitive/ R: Resistive
Aluminum Die-casting Chassis
202 x 149 x 58 mm
IP66 Compliant Front Bezel
Panel Mount, VESA 75 x 75
1.35 kg
CE/FCC class A
-20~60˚C
10 to 95%@ 40˚C, non-condensing
-30~70˚C
Windows 10 IoT Enterprise 2021 LTSC
Windows 11 (21H2) or later
Linux 18.04 or later
ARCHMI-S-807BP(H):
7" (High brightness) WVGA fanless HMI barebone with Intel Celeron J6412 (2.0 GHz) CPU, 1 x DDR4 slot, Projected Capacitive touch, 9~36V DC input with adapter, Aluminum chassis
ARCHMI-S-807BR(H):
7" (High brightness) WVGA fanless HMI barebone with Intel Celeron J6412 (2.0 GHz) CPU, 1 x DDR4 slot, Resistive touch screen, 9~36V DC input with adapter, Aluminum chassis.
8" TFT-LCD
P: Projected Capacitive/ R: Resistive
Standard: 450
High Brightness: 1000
AMI UEFI
Intel Celeron J6412 Quad Core Processor
ARCHMI-S-808BP/R: 28W (Max)
SoC
1 x DDR4 3200MHz SO-DIMM, up to 32GB
Onboard TPM2.0 SPI I/F TPM IC
1 x Line-out
1 x DisplayPort 1.4: Up to 4096 x 2160@60Hz
1 x RJ45 Type Intel I210AT 1GbE LAN
1 x RJ45 Type Intel I225LM/I226LM 2.5GbE LAN
*Wake on LAN: Support WOL
1 x Terminal Block Type, 9-36V DC Power input
1 x DB9 RS-232/422/485 (COM1, BIOS selection)
2 x USB 3.2 Type A
1~255 sec (system)
1 x M.2 M-Key 2242/2280 for SSD (SATA3)
1 x Mini-PCIe slot (full size, PCIe3.0 x1, USB2.0), with 1 x micro SIM slot
1 x M.2 E-Key 2230 for WiFi/BT module (USB2.0, PCIe3.0x1)
Standard: 40,000
High Brightness: 50,000
Standard: 500:1
High Brightness: 1000:1
8" TFT-LCD
Standard: 450
High Brightness: 1000
Standard: 262K
High Brightness: 16.2M
800 x 600
Standard: 140 / 130
High Brightness: 140 / 120
USB
Projected Capacitive Touch: Over 90%
Resistive Touch: 80%
P: Projected Capacitive/ R: Resistive
Aluminum Die-casting Chassis
231.1 x 176.1 x 69 mm
IP66 Compliant Front Bezel
Panel Mount, VESA 75 x 75
2.17kg
CE/FCC class A
-20~60˚C
10 to 95%@ 40˚C, non-condensing
-30~70˚C
Windows 10 IoT Enterprise 2021 LTSC
Windows 11 (21H2) or later
Linux 18.04 or later
ARCHMI-S-808BP(H):
8" (High brightness) SVGA fanless HMI barebone with Intel Celeron J6412 (2.0 GHz) CPU, 1 x DDR4 slot, Projected Capacitive touch, 9~36VDC input with adapter, Aluminum chassis.
ARCHMI-S-808BR(H):
8" (High brightness) SVGA fanless HMI barebone with Intel Celeron J6412 (2.0 GHz) CPU, 1 x DDR4 slot, Resistive touch screen, 9~36VDC input with adapter, Aluminum chassis.
10.1" TFT-LCD
P: Projected Capacitive/ R: Resistive
Standard: 350
High Brightness: 1000
AMI UEFI
Intel Celeron J6412 Quad Core Processor
ARCHMI-S-810BP/R: 28W (Max)
SoC
1 x DDR4 3200MHz SO-DIMM, up to 32GB
Onboard TPM2.0 SPI I/F TPM IC
1 x Line-out
1 x DisplayPort 1.4: Up to 4096 x 2160@60Hz
1 x RJ45 Type Intel I210AT 1GbE LAN
1 x RJ45 Type Intel I225LM/I226LM 2.5GbE LAN
*Wake on LAN: Support WOL
1 x Terminal Block Type, 9-36VDC Power input
1 x DB9 RS-485/422/232 (COM1, BIOS selection, RS-232 is default)
1 x DB9 Type RS-232
2 x USB 3.2 Type A
2 x USB 2.0 Type A
1~255 sec (system)
1 x M.2 M-Key 2242/2280 for SSD (SATA3)
1 x Mini-PCIe slot (full size, PCIe3.0 x1, USB2.0), with 1 x micro SIM slot
1 x M.2 E-Key 2230 for WiFi/BT module (USB2.0, PCIe3.0x1)
Standard: 30,000
High Brightness: 50,000
Standard: 800:1
High Brightness: 1200:1
10.1" TFT-LCD
Standard: 350
High Brightness: 1000
16.7M
1280 x 800
Standard: 170 / 170
High Brightness: 178 / 178
USB
Projected Capacitive Touch: Over 90%
Resistive Touch: 80%
P: Projected Capacitive/ R: Resistive
Aluminum Die-casting Chassis
285 x 189 x 75 mm
IP66 Compliant Front Bezel
Panel Mount, VESA 100 x 100
2.7 kg
CE/FCC class A
-20~60˚C
10 to 95%@ 40˚C, non-condensing
-30~70˚C
Windows 10 IoT Enterprise 2021 LTSC
Windows 11 (21H2) or later
Linux 18.04 or later
ARCHMI-S-810BP(H):
10.1" (High brightness) WXGA fanless HMI barebone with Intel Celeron J6412 (2.0 GHz) CPU, 1 x DDR4 slot, Projected Capacitive touch, 9~36VDC input with adapter, Aluminum chassis.
ARCHMI-S-810BR(H):
10.1" (High brightness) WXGA fanless HMI barebone with Intel Celeron J6412 (2.0 GHz) CPU, 1 x DDR4 slot, Resistive touch screen, 9~36VDC input with adapter, Aluminum chassis.
12.1" TFT-LCD
P: Projected Capacitive/ R: Resistive
Standard: 450 (default), 500 (optional)
High Brightness: 1000
AMI UEFI
Intel Celeron J6412 Quad Core Processor
ARCHMI-S-812BP/R: 33W (Max)
SoC
1 x DDR4 3200MHz SO-DIMM, up to 32GB
Onboard TPM2.0 SPI I/F TPM IC
1 x Line-out
1 x DisplayPort 1.4: Up to 4096 x 2160@60Hz
1 x RJ45 Type Intel I210AT 1GbE LAN
1 x RJ45 Type Intel I225LM/I226LM 2.5GbE LAN
*Wake on LAN: Support WOL
1 x Terminal Block Type, 9-36VDC Power input
1 x DB9 RS-485/422/232 (COM1, BIOS selection, RS-232 is default)
1 x DB9 Type RS-232
2 x USB 3.2 Type A
2 x USB 2.0 Type A
1~255 sec (system)
1 x M.2 M-Key 2242/2280 for SSD (SATA3)
1 x Mini-PCIe slot (full size, PCIe3.0 x1, USB2.0), with 1 x micro SIM slot
1 x M.2 E-Key 2230 for WiFi/BT module (USB2.0, PCIe3.0x1)
Standard: 50,000 (default), 30,000 (optional)
High Brightness: 50,000 (default), 70,000 (optional)
Standard: 1500:1 (default), 1000:1 (optional)
High Brightness: 1000:1
12.1" TFT-LCD
Standard: 450 (default), 500 (optional)
High Brightness: 1000
Standard: 16.2M
High Brightness: 16.7M (default), 16.2M (optional)
800 x 600 (default)
1024 x 768 (optional)
Standard: 178 / 178
High Brightness: 176 / 176 (default), 178 / 178 (optional)
USB
Projected Capacitive Touch: Over 90%
Resistive Touch: 80%
P: Projected Capacitive/ R: Resistive
Aluminum Die-casting Chassis
314 x 244.9 x 77 mm
IP66 Compliant Front Bezel
Panel Mount, VESA 100 x 100
3.3 kg
CE/FCC class A
-20~60˚C
10 to 95%@ 40˚C, non-condensing
-30~70˚C
Windows 10 IoT Enterprise 2021 LTSC
Windows 11 (21H2) or later
Linux 18.04 or later
ARCHMI-S-812BP(H):
12.1" (High brightness) SVGA/XGA fanless HMI barebone with Intel Celeron J6412 (2.0 GHz) CPU, 1 x DDR4 slot, Projected Capacitive touch, 9~36VDC input with adapter, Aluminum chassis.
ARCHMI-S-812BR(H):
12.1" (High brightness) SVGA/XGA fanless HMI barebone with Intel Celeron J6412 (2.0 GHz) CPU, 1 x DDR4 slot, Resistive touch screen, 9~36VDC input with adapter, Aluminum chassis.
12.1" TFT-LCD Wide
P: Projected Capacitive/ R: Resistive
Standard: 400
High Brightness: 1000
AMI UEFI
Intel Celeron J6412 Quad Core Processor
ARCHMI-S-812WBP/R: Around 32.15W
SoC
1 x DDR4 3200MHz SO-DIMM, up to 32GB
Onboard TPM2.0 SPI I/F TPM IC
1 x Line-out
1 x DisplayPort 1.4: Up to 4096 x 2160@60Hz
1 x RJ45 Type Intel I210AT 1GbE LAN
1 x RJ45 Type Intel I225LM/I226LM 2.5GbE LAN
*Wake on LAN: Support WOL
1 x Terminal Block Type, 9-36VDC Power input
1 x DB9 RS-485/422/232 (COM1, BIOS selection, RS-232 is default)
1 x DB9 Type RS-232
2 x USB 3.2 Type A
2 x USB 2.0 Type A
1~255 sec (system)
1 x M.2 M-Key 2242/2280 for SSD (SATA3)
1 x Mini-PCIe slot (full size, PCIe3.0 x1, USB2.0), with 1 x micro SIM slot
1 x M.2 E-Key 2230 for WiFi/BT module (USB2.0, PCIe3.0x1)
50,000
Standard: 1200:1
High Brightness: 1000:1
12.1" TFT-LCD Wide
Standard: 400
High Brightness: 1000
16.7M
1280 x 800
Standard: 170 / 170
High Brightness: 176 / 176
USB
Projected Capacitive Touch: Over 90%
Resistive Touch: 80%
P: Projected Capacitive/ R: Resistive
Aluminum Die-casting Chassis
328 x 227 x 78 mm
IP66 Compliant Front Bezel
Panel Mount, VESA 100 x 100
3.27 kg
CE/FCC class A
-20~60˚C
10 to 95%@ 40˚C, non-condensing
-30~70˚C
Windows 10 IoT Enterprise 2021 LTSC
Windows 11 (21H2) or later
Linux 18.04 or later
ARCHMI-S-812WBP(H):
12.1" (High brightness) WXGA fanless HMI barebone with Intel Celeron J6412 (2.0 GHz) CPU, 1 x DDR4 slot, Projected Capacitive touch, 9~36VDC input with adapter, Aluminum chassis.
ARCHMI-S-812WBR(H):
12.1" (High brightness) WXGA fanless HMI barebone with Intel Celeron J6412 (2.0 GHz) CPU, 1 x DDR4 slot, Resistive touch screen, 9~36VDC input with adapter, Aluminum chassis.
15" TFT-LCD
P: Projected Capacitive/ R: Resistive
Standard: 350
High Brightness: 1000
AMI UEFI
Intel Celeron J6412 Quad Core Processor
ARCHMI-S-815BP/R: 37W (Max)
SoC
1 x DDR4 3200MHz SO-DIMM, up to 32GB
Onboard TPM2.0 SPI I/F TPM IC
1 x Line-out
1 x DisplayPort 1.4: Up to 4096 x 2160@60Hz
1 x RJ45 Type Intel I210AT 1GbE LAN
1 x RJ45 Type Intel I225LM/I226LM 2.5GbE LAN
*Wake on LAN: Support WOL
1 x Terminal Block Type, 9-36VDC Power input
1 x DB9 RS-485/422/232 (COM1, BIOS selection, RS-232 is default)
1 x DB9 Type RS-232
2 x USB 3.2 Type A
2 x USB 2.0 Type A
1~255 sec (system)
1 x M.2 M-Key 2242/2280 for SSD (SATA3)
1 x Mini-PCIe slot (full size, PCIe3.0 x1, USB2.0), with 1 x micro SIM slot
1 x M.2 E-Key 2230 for WiFi/BT module (USB2.0, PCIe3.0x1)
Standard: 50,000
High Brightness: 70,000
Standard: 1,000:1
High Brightness: 3,000:1
15" TFT-LCD
Standard: 350
High Brightness: 1000
16.7M
1024 x 768
Standard: 178 / 178
High Brightness: 176 / 176
USB
Projected Capacitive Touch: Over 90%
Resistive Touch: 80%
P: Projected Capacitive/ R: Resistive
Aluminum Die-casting Chassis
410.2 x 310.2 x 78.7 mm
IP66 Compliant Front Bezel
Panel Mount, VESA 100 x 100
5 kg
CE/FCC class A
-20~60˚C
10 to 95%@ 40˚C, non-condensing
-30~70˚C
Windows 10 IoT Enterprise 2021 LTSC
Windows 11 (21H2) or later
Linux 18.04 or later
ARCHMI-S-815BP(H):
15" (High brightness) XGA fanless HMI barebone with Intel Celeron J6412 (2.0 GHz) CPU, 1 x DDR4 slot, Projected Capacitive touch, 9~36VDC input with adapter, Aluminum chassis.
ARCHMI-S-815BR(H):
15" (High brightness) XGA fanless HMI barebone with Intel Celeron J6412 (2.0 GHz) CPU, 1 x DDR4 slot, Resistive touch screen, 9~36VDC input with adapter, Aluminum chassis.
15.6" TFT-LCD
P: Projected Capacitive/ R: Resistive
Standard: 500
High Brightness: 1000
AMI UEFI
Intel Celeron J6412 Quad Core Processor
ARCHMI-S-816BP/R: 50W (Max)
SoC
1 x DDR4 3200MHz SO-DIMM, up to 32GB
Onboard TPM2.0 SPI I/F TPM IC
1 x Line-out
1 x DisplayPort 1.4: Up to 4096 x 2160@60Hz
1 x RJ45 Type Intel I210AT 1GbE LAN
1 x RJ45 Type Intel I225LM/I226LM 2.5GbE LAN
*Wake on LAN: Support WOL
1 x Terminal Block Type, 9-36VDC Power input
1 x DB9 RS-485/422/232 (COM1, BIOS selection, RS-232 is default)
1 x DB9 Type RS-232
2 x USB 3.2 Type A
2 x USB 2.0 Type A
1~255 sec (system)
1 x M.2 M-Key 2242/2280 for SSD (SATA3)
1 x Mini-PCIe slot (full size, PCIe3.0 x1, USB2.0), with 1 x micro SIM slot
1 x M.2 E-Key 2230 for WiFi/BT module (USB2.0, PCIe3.0x1)
50,000
1,000:1
15.6" TFT-LCD
Standard: 500
High Brightness: 1000
16.7M
1920 x 1080
Standard: 178 / 178
High Brightness: 170 / 170
USB
Projected Capacitive Touch: Over 90%
Resistive Touch: 80%
P: Projected Capacitive/ R: Resistive
Aluminum Die-casting Chassis
412 x 277.5 x 78 mm
IP66 Compliant Front Bezel
Panel Mount, VESA 100 x 100
4.2 kg
CE/FCC class A
-20~60˚C
10 to 95%@ 40˚C, non-condensing
-30~70˚C
Windows 10 IoT Enterprise 2021 LTSC
Windows 11 (21H2) or later
Linux 18.04 or later
ARCHMI-S-816BP(H):
15.6" (High brightness) FHD fanless HMI barebone with Intel Celeron J6412 (2.0 GHz) CPU, 1 x DDR4 slot, Projected Capacitive touch, 9~36VDC input with adapter, Aluminum chassis.
ARCHMI-S-816BR(H):
15.6" (High brightness) FHD fanless HMI barebone with Intel Celeron J6412 (2.0 GHz) CPU, 1 x DDR4 slot, Resistive touch screen, 9~36VDC input with adapter, Aluminum chassis.
17" TFT-LCD
P: Projected Capacitive/ R: Resistive
Standard: 350
High Brightness: 1000
AMI UEFI
Intel Celeron J6412 Quad Core Processor
ARCHMI-S-817BP/R: 46W (Max)
SoC
1 x DDR4 3200MHz SO-DIMM, up to 32GB
Onboard TPM2.0 SPI I/F TPM IC
1 x Line-out
1 x DisplayPort 1.4: Up to 4096 x 2160@60Hz
1 x RJ45 Type Intel I210AT 1GbE LAN
1 x RJ45 Type Intel I225LM/I226LM 2.5GbE LAN
*Wake on LAN: Support WOL
1 x Terminal Block Type, 9-36VDC Power input
1 x DB9 RS-485/422/232 (COM1, BIOS selection, RS-232 is default)
1 x DB9 Type RS-232
2 x USB 3.2 Type A
2 x USB 2.0 Type A
1~255 sec (system)
1 x M.2 M-Key 2242/2280 for SSD (SATA3)
1 x Mini-PCIe slot (full size, PCIe3.0 x1, USB2.0), with 1 x micro SIM slot
1 x M.2 E-Key 2230 for WiFi/BT module (USB2.0, PCIe3.0x1)
50,000
Standard: 1,000:1
High Brightness: 800:1
17" TFT-LCD
Standard: 350
High Brightness: 1000
16.7M
1280 x 1024
Standard: 160 / 140
High Brightness: 170 / 160
USB
Projected Capacitive Touch: Over 90%
Resistive Touch: 80%
P: Projected Capacitive/ R: Resistive
Aluminum Die-casting Chassis
439 x 348 x 82 mm
IP66 Compliant Front Bezel
Panel Mount, VESA 100 x 100
5.95 kg
CE/FCC class A
-20~60˚C
10 to 95%@ 40˚C, non-condensing
-30~70˚C
Windows 10 IoT Enterprise 2021 LTSC
Windows 11 (21H2) or later
Linux 18.04 or later
ARCHMI-S-817BP(H):
17" (High brightness) SXGA fanless HMI barebone with Intel Celeron J6412 (2.0 GHz) CPU, 1 x DDR4 slot, Projected Capacitive touch, 9~36VDC input with adapter, Aluminum chassis.
ARCHMI-S-817BR(H):
17" (High brightness) SXGA fanless HMI barebone with Intel Celeron J6412 (2.0 GHz) CPU, 1 x DDR4 slot, Resistive touch screen, 9~36VDC input with adapter, Aluminum chassis.
18.5" TFT-LCD
P: Projected Capacitive/ R: Resistive
Standard: 350
High Brightness: 1000
AMI UEFI
Intel Celeron J6412 Quad Core Processor
ARCHMI-S-818BP/R: 60.55W(Max)
SoC
1 x DDR4 3200MHz SO-DIMM, up to 32GB
Onboard TPM2.0 SPI I/F TPM IC
1 x Line-out
1 x DisplayPort 1.4: Up to 4096 x 2160@60Hz
1 x RJ45 Type Intel I210AT 1GbE LAN
1 x RJ45 Type Intel I225LM/I226LM 2.5GbE LAN
*Wake on LAN: Support WOL
1 x Terminal Block Type, 9-36VDC Power input
1 x DB9 RS-485/422/232 (COM1, BIOS selection, RS-232 is default)
1 x DB9 Type RS-232
2 x USB 3.2 Type A
2 x USB 2.0 Type A
1~255 sec (system)
1 x M.2 M-Key 2242/2280 for SSD (SATA3)
1 x Mini-PCIe slot (full size, PCIe3.0 x1, USB2.0), with 1 x micro SIM slot
1 x M.2 E-Key 2230 for WiFi/BT module (USB2.0, PCIe3.0x1)
50,000
1,000:1
18.5" TFT-LCD
Standard: 350
High Brightness: 1000
16.7M
1920 x 1080
178 / 178
USB
Projected Capacitive Touch: Over 90%
Resistive Touch: 80%
P: Projected Capacitive/ R: Resistive
Aluminum Die-casting Chassis
499.6 x 314.6 x 82 mm
IP66 Compliant Front Bezel
Panel Mount, VESA 100 x 100
6.85 kg
CE/FCC class A
-20~60˚C
10 to 95%@ 40˚C, non-condensing
-30~70˚C
Windows 10 IoT Enterprise 2021 LTSC
Windows 11 (21H2) or later
Linux 18.04 or later
ARCHMI-S-818BP(H):
18.5" (High brightness) FHD high brightness SXGA fanless HMI barebone with Intel Celeron J6412 (2.0 GHz) CPU, 1 x DDR4 slot, Projected Capacitive touch, 9~36VDC input with adapter, Aluminum chassis.
ARCHMI-S-818BR(H):
18.5" (High brightness) FHD high brightness SXGA fanless HMI barebone with Intel Celeron J6412 (2.0 GHz) CPU, 1 x DDR4 slot, Resistive touch screen, 9~36VDC input with adapter, Aluminum chassis.
19" TFT-LCD
P: Projected Capacitive/ R: Resistive
Standard: 350
High Brightness: 1000
AMI UEFI
Intel Celeron J6412 Quad Core Processor
ARCHMI-S-819BP/R: 50W (Max)
SoC
1 x DDR4 3200MHz SO-DIMM, up to 32GB
Onboard TPM2.0 SPI I/F TPM IC
1 x Line-out
1 x DisplayPort 1.4: Up to 4096 x 2160@60Hz
1 x RJ45 Type Intel I210AT 1GbE LAN
1 x RJ45 Type Intel I225LM/I226LM 2.5GbE LAN
*Wake on LAN: Support WOL
1 x Terminal Block Type, 9-36VDC Power input
1 x DB9 RS-485/422/232 (COM1, BIOS selection, RS-232 is default)
1 x DB9 Type RS-232
2 x USB 3.2 Type A
2 x USB 2.0 Type A
1~255 sec (system)
1 x M.2 M-Key 2242/2280 for SSD (SATA3)
1 x Mini-PCIe slot (full size, PCIe3.0 x1, USB2.0), with 1 x micro SIM slot
1 x M.2 E-Key 2230 for WiFi/BT module (USB2.0, PCIe3.0x1)
50,000
Standard: 1,000:1
High Brightness: 1,200:1
19" TFT-LCD
Standard: 350
High Brightness: 1000
16.7M
1280 x 1024
170 / 160
USB
Projected Capacitive Touch: Over 90%
Resistive Touch: 80%
P: Projected Capacitive/ R: Resistive
Aluminum Die-casting Chassis
468 x 380 x 82 mm
IP66 Compliant Front Bezel
Panel Mount, VESA 100 x 100
7.23 kg
CE/FCC class A
-20~60˚C
10 to 95%@ 40˚C, non-condensing
-30~70˚C
Windows 10 IoT Enterprise 2021 LTSC
Windows 11 (21H2) or later
Linux 18.04 or later
ARCHMI-S-819BP(H):
19" (High brightness) SXGA fanless HMI barebone with Intel Celeron J6412 (2.0 GHz) CPU, 1 x DDR4 slot, Projected Capacitive touch, 9~36VDC input with adapter, Aluminum chassis.
ARCHMI-S-819BR(H):
19" (High brightness) SXGA fanless HMI barebone with Intel Celeron J6412 (2.0 GHz) CPU, 1 x DDR4 slot, Resistive touch screen, 9~36VDC input with adapter, Aluminum chassis.
21.5" TFT-LCD
P: Projected Capacitive/ R: Resistive
Standard: 300
High Brightness: 1000
AMI UEFI
Intel Celeron J6412 Quad Core Processor
ARCHMI-S-821BP/R: 37W (Max)
SoC
1 x DDR4 3200MHz SO-DIMM, up to 32GB
Onboard TPM2.0 SPI I/F TPM IC
1 x Line-out
1 x DisplayPort 1.4: Up to 4096 x 2160@60Hz
1 x RJ45 Type Intel I210AT 1GbE LAN
1 x RJ45 Type Intel I225LM/I226LM 2.5GbE LAN
*Wake on LAN: Support WOL
1 x Terminal Block Type, 9-36VDC Power input
1 x DB9 RS-485/422/232 (COM1, BIOS selection, RS-232 is default)
1 x DB9 Type RS-232
2 x USB 3.2 Type A
2 x USB 2.0 Type A
1~255 sec (system)
1 x M.2 M-Key 2242/2280 for SSD (SATA3)
1 x Mini-PCIe slot (full size, PCIe3.0 x1, USB2.0), with 1 x micro SIM slot
1 x M.2 E-Key 2230 for WiFi/BT module (USB2.0, PCIe3.0x1)
50,000
1,000:1
21.5" TFT-LCD
Standard: 300
High Brightness: 1000
16.7M
1920 x 1080
178 / 178
USB
Projected Capacitive Touch: Over 90%
Resistive Touch: 80%
P: Projected Capacitive/ R: Resistive
Aluminum Die-casting Chassis
557.3 x 362.3 x 82 mm
IP66 Compliant Front Bezel
Panel Mount, VESA 100 x 100
6.85 kg
CE/FCC class A
0~50˚C
10 to 95%@ 40˚C, non-condensing
-30~70˚C
Windows 10 IoT Enterprise 2021 LTSC
Windows 11 (21H2) or later
Linux 18.04 or later
ARCHMI-S-821BP(H):
21.5" (High brightness) FHD fanless HMI barebone with Intel Celeron J6412 (2.0 GHz) CPU, 1 x DDR4 slot, Projected Capacitive touch, 9~36VDC input with adapter, Aluminum chassis.
ARCHMI-S-821BR(H):
21.5" (High brightness) FHD fanless HMI barebone with Intel Celeron J6412 (2.0 GHz) CPU, 1 x DDR4 slot, Resistive touch screen, 9~36VDC input with adapter, Aluminum chassis
23.8" TFT-LCD
Projected Capacitive Touch
Standard: 250
High Brightness: 1,000
AMI UEFI
Intel Celeron J6412 Quad Core Processor
ARCHMI-S-824BP: 43W(Max)
SoC
1 x DDR4 3200MHz SO-DIMM, up to 32GB
Onboard TPM2.0 SPI I/F TPM IC
1 x Line-out
1 x DisplayPort 1.4: Up to 4096 x 2160@60Hz
1 x RJ45 Type Intel I210AT 1GbE LAN
1 x RJ45 Type Intel I225LM/I226LM 2.5GbE LAN
Wake on LAN: Support WOL
1 x Terminal Block Type, 9-36V DC Power input
1 x DB9 RS-485/422/232 (COM1, BIOS selection, RS-232 is default)
1 x DB9 Type RS-232
2 x USB 3.2 Type A
2 x USB 2.0 Type A
1~255 sec (system)
1 x M.2 M-Key 2242/2280 for SSD (SATA3)
1 x Mini-PCIe slot (full size, PCIe3.0 x1, USB2.0), with 1 x micro SIM slot
1 x M.2 E-Key 2230 for WiFi/BT module (USB2.0, PCIe3.0x1)
30,000
3,000:1
23.8" TFT-LCD
Standard: 250
High Brightness: 1,000
16.7M
Standard: 1920 x 1080
High Brightness: 1920 x 1080, FHD
178 / 178
USB
90%
Projected Capacitive Touch
Aluminum Die-casting Chassis
640 x 395 x 88 mm
IP66 Compliant Front Bezel
Panel Mount, VESA 100 x 100
9.43 kg
CE/FCC class A
0~50˚C
10 to 95%@ 40˚C, non-condensing
-30~70˚C
Windows 10 IoT Enterprise 2021 LTSC
Windows 11 (21H2) or later
Linux 18.04 or later
ARCHMI-S-824BP:
23.8" FHD fanless HMI barebone with Intel Celeron J6412 (2.0 GHz) CPU, 1 x DDR4 slot, Projected Capacitive touch, 9~36VDC input with adapter, Aluminum chassis
ARCHMI-S-824BPH:
23.8" high brightness FHD fanless HMI barebone with Intel Celeron J6412 (2.0 GHz) CPU, 1 x DDR4 slot, Projected Capacitive touch, 9~36VDC input with adapter, Aluminum chassis
